RIR Power to Begin Semiconductor Production by March, Confirms Odisha IT Secretary

Rapid Summary

• RIR Power Electronics Ltd. will begin full-scale commercial electronic chip production by March 2026 at its Bhubaneswar plant in Odisha, according to Vishal Dev, Principal Secretary of the Electronics & IT Department.
• Two additional projects-SiCSem and 3D Glass Solutions (3DGS)-are slated to start production within two years in Info Valley, bhubaneswar.
• RIR Power’s silicon carbide manufacturing plant received ₹32.56 crore fiscal support for Phase 1 on September 1, with the total project cost estimated at ₹618 crore across two phases.
• The Union Cabinet approved semiconductor manufacturing units in four states (including Odisha) for a total outlay of ₹4,600 crore on August 12. SiCSem is partnering with Clas-SiC Wafer Fab Ltd., while 3DGS aims to establish advanced packaging facilities for glass substrates-all within Info Valley industrial cluster.
• Odisha is leveraging its advantages as a power-surplus state with abundant water resources and affordable electricity while targeting skilled workforce development under the state’s thorough electronics policy.
• The new Electronics Component Manufacturing Policy (2025) offers incentives such as a capital investment subsidy of up to 30% and significant support for assembly/testing setups and fabs without caps.

Read more: The Hindu

Indian Opinion Analysis
The upcoming semiconductor industry developments signify major progress toward India’s self-reliance aspirations in advanced electronics manufacturing-a critical sector increasingly tied to geopolitical relevance and global supply chains. Odisha’s proactive investment framework and resource advantage position it competitively among states aiming to attract cutting-edge technology firms.

RIR Power Electronics’ imminent commercial chip production coudl elevate regional economic growth through job creation and industrial ecosystem buildup around Bhubaneswar’s Info Valley cluster. Additionally, partnerships such as SiCSem’s tie-up with Clas-SiC Wafer Fab reflect evolving collaboration between Indian entities and global tech leaders-a step that may accelerate knowledge transfer essential for scaling domestic innovation capacity.

Odisha’s tailored subsidies and skilling initiatives demonstrate foresight in addressing logistical challenges central to high-tech industries like semiconductors; however, execution efficiency will be key as competition among states intensifies within India’s broader semiconductor mission backed by significant federal funding allocations.